Method of material processing with laser pulses having a large spectral bandwidth and apparatus for carrying out said method

ABSTRACT

A method and device for processing materials with laser pulses having a large spectral bandwidth and a device for carrying out said method. The aim of the invention is to create an easy, flexible method enabling universally applicable processing which can, however, be adapted to specific processing and methodological requirements. According to the invention, one or several spectral parameters of the laser pulses, i.e. the spectral amplitude and/or spectral phase and/or spectral polarization thereof, is/are specifically modified, preferably according to a measuring process variable, in order to process material or during the occurrence of said processing. The invention is used in order to process material with laser pulses having a large spectral bandwidth, particularly femto-second pulses and pico-second pulses.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of application Ser. No. 10/565,582,filed Jul. 10, 2006 (U.S. Pat. No. 7,989,731 issuing Aug. 2, 2011),which application is a 371 of PCT/EP2004/008090, filed Jul. 20, 2004,which claims the benefit of DE application number 10333770.9, filed Jul.23, 2003. Said applications are herein incorporated by reference hereinin their entirety.

FIELD OF THE INVENTION

The invention relates to a method of material processing with laserpulses having a large spectral bandwidth, in particular with femtosecondand picosecond pulses, as well as to an apparatus for carrying out saidmethod.

BACKGROUND

A multiplicity of methods are known which utilize the interaction ofelectromagnetic radiation in the infrared, visible and ultravioletspectral ranges with matter to melt, evaporate, remove (ablate) material(U.S. Pat. No. 4,194,226), to induce phase transitions (U.S. Pat. No.6,329,270) or to modify other physical or chemical material properties.

If the field of interaction between laser light and a workpiece isspatially shaped on the surface of the workpiece, e.g. by optical masksor by successive shifting of the laser focus, it is possible tosuccessfully generate line- and area-type structures during processing;and three-dimensional structures can be achieved by layered removal aswell as, in transparent media, by positioning the laser focus in thedepth of the material (DE 100 06 081 A1).

Many of these methods require high power densities, which can beachieved in particular by application of pulsed laser radiation sources.By using laser pulses of short duration (a few nanoseconds),particularly efficient processing is achieved (U.S. Pat. No. 6,281,471).Interfering modifications of the workpiece outside the zone ofinteraction, which are caused by thermal effects, can be further reducedthrough an even shorter pulse duration (U.S. Pat. No. 6,150,630). It isthus possible, e.g. by means of ablation, to generate very finestructures, wherein the size of the material areas in which aninteraction with the radiation occurs and those which experience nosubstantial modification as compared to their initial condition is givenonly by the size of the laser focus. The theoretical limit for theminimal structural dimensions is then given by the diffraction limitand, thus, ultimately by the wavelength of the laser radiation used. Inparticular, the use of laser pulses with pulse durations ranging fromapproximately 20 fs to 1,000 ps enables direct micro-processing ofmaterial (F. Korte et. al.: “Sub-diffraction limited structuring ofsolid targets with femtosecond laser pulses”, Optics Express 7, 2000,41), which includes, in addition to technical uses, also medical uses,in particular in microsurgery. Moreover, apparatuses for generatingspectrally broad-band laser pulses are widely applied asultrashort-pulse lasers in research.

Two experimental papers by Stoian et al. (R. Stoian et al.: “Laserablation of dielectrics with temporally shaped femtosecond pulses”,Appl. Phys. Lett. 80, 2002, 63; R. Stoian et al.: “Ultrafast lasermaterial processing using dynamic temporal pulse shaping”, RIKEN Review50,2003) disclose how the structuring process in laser ablation can beoptimized as regards reducing residual damage by means of temporalshaped laser pulses. For this purpose, different pulse trains weregenerated by means of phase modulation, and the advantages of their useas compared to unshaped laser pulses of the laser system used inablative laser boring of selected materials were experimentally shownunder vacuum conditions. In doing so, unshaped and shaped laser pulseswere respectively directed onto the surface of a-SiO₂ and Al₂O₃ forcomparison and the result of processing was then visually analyzed withthe help of a light microscope.

In laser material processing of composite materials, it is possible toselect the amplitude spectrum of the laser pulses used such thatmaterial-selective processing is possible. The selection of a suitablelaser under the aspect of adapting the laser wavelength to the materialto be processed is a known method (e.g. U.S. Pat. No. 5,948,214, U.S.Pat. No. 5,948,214, U.S. Pat. No. 4,399,345, and U.S. Pat. No.5,569,398). However, the physical-technical properties of the object tobe processed may change during the processing operation, e.g. bymaterial heating. In particular, changes of the absorptioncharacteristic of composites limit material selectivity in theprocessing operation (U.S. Pat. No. 6,281,471), because an adequatechange of the laser wavelength is hardly possible with the lasers usedfor material processing.

Therefore, a method had to be provided making processing effectspossible with as little effort as possible and in a manner as flexibleand as universally applicable as possible, said effects respectivelybeing specifically determinable and adaptable with regard to theprocessing task and the course of the process.

SUMMARY OF THE INVENTION

According to the invention, one or more spectral parameters of the laserpulses, i.e. the spectral amplitude and/or the spectral phase and/or thespectral polarization, are selectively changed for or during thematerial processing process, respectively, in order to cause definedprocessing-specific effects thereby, e.g. an increase in the processingspeed, an improvement in material selectivity or an improvement insurface structuring. It is advantageous, if at least one spectralparameter is modified as a function of a parameter of measurement fromthe processing process, preferably in a closed-loop control circuit.More detailed specifications are given in this respect in the subclaims.

In this manner, it is possible, on the one hand, to effect the bestpossible setting of the spectral laser pulse parameters (for example, onthe basis of test results or other experiences or calculations) for theintended processing operation and the intended effect of said materialprocessing. Moreover, on the other hand, said spectral laser pulseparameters can not only be pre-selected in a defined manner, but canalso be modified and adapted for the material processing process and/orduring its execution as a function of a control variable obtaineddirectly from the processing operation with regard to the intendedprocessing effect. Insofar, the modification of physical-technicalproperties of the object to be processed and the process conditionsduring the processing operation can be responded to so as to improve orat least not to affect the intended processing effect. For example inthe case of material heating, which generally does not leave materialselectivity unaffected in the processing of composite materials, thespectral amplitude of the laser pulses as a function of the interactionof the laser pulses with the composite materials can be dynamicallymodified as a measurable quantity. These modifications can be effectedboth continuously or in intervals directly during the processingoperation (closed-loop control operation) and with interruption of theprocessing operation and re-adjustment of the spectral parameters forcontinuation of said operation.

Our own investigations as to micro-structuring of optically anisotropicmaterials show that selective modification of the frequency componentsof a spectrally broad-band laser pulse allows control of the process ofinteraction between the laser pulse and the object to be processed. Inparticular, the simultaneous closed-loop control of spectralpolarization and of spectral phase in processing anisotropic materialsenables control of that structuring process which is utilized togenerate anisotropic wave guide structures, especially because knownexperimental results (F. Korte et. al.: “Sub-diffraction limitedstructuring of solid targets with femtosecond laser pulses”, OpticsExpress 7, 2000, 41) show that even in laser processing of opticallyisotropic materials not only a local change in refractive index iseffected, but local anisotropy is usually induced as well.

Possibilities of modifying the spectral parameters of spectrallybroad-band laser pulses per se are well known (U.S. Pat. No. 4,626,257or Brixner and Gerber: Optics Letters 26, 2001, 267). In particular,modulators on the basis of micro-electromechanic systems (MEMS) appearto have great potential for future industrial application (Hacker etal.: “Micromirror SLM for femtosecond pulse shaping in the ultraviolet”,Appl. Phys. B 76, 2003, 711).

BRIEF DESCRIPTION OF THE DRAWINGS

The invention shall be explained in more detail below with reference todepictions in the drawings, wherein:

FIG. 1 schematically shows a design of an apparatus for materialprocessing with shaping of the spectral laser pulse parameters, and

FIG. 2 schematically shows a design of an apparatus for laser-basedinterruption of electrically conductive paths on a microchip withmodification of the spectral amplitude of the laser pulses.

DETAILED DESCRIPTION

A short-pulse laser 1 as a source of broadband laser pulses 1 isconnected via a pulse shaper 2 for shaping the spectral parameters ofthe laser pulses to a processing unit 3 for material processing of anobject to be processed, which is not shown. The pulses of theshort-pulse lasers 1 are thus shaped as regards their spectral amplitudeand/or the spectral phase and/or the spectral polarization and cause, inthe processing unit 3, a physical-technical interaction with thematerial when impinging on the object to be processed. The shaped laserpulses (as shown in broken lines) may optionally also be supplied to theprocessing unit 3 via an optical amplifier 4.

Through modification of one or more of the spectral parameters of thelaser pulses by the pulse shaper 2, the interaction of the laser pulseswith the material of the object to be processed can be influenced inorder to achieve defined processing-specific effects, e.g. with regardto processing speed, material selectivity or surface structuring, for orduring the processing process.

It is thus advantageous if the modification of spectral parameters ischanged as a function of a measurable quantity of material processing,which serves as a control variable. For this purpose, a measurement unit5 is preferably coupled to the processing unit 3 including the object tobe processed, which measurement unit 5 is connected to the impulseshaper 2 via a control unit 6. For example, the measurement unit 5measures the ablation rate, the surface roughness or the material orenvironmental temperature, respectively, of the object to be processedand supplies a control variable via the control unit 6 as a function ofthe measurable quantity for modifying the spectral amplitude and/or thespectral phase and/or the spectral polarization of the pulses of theshort-pulse laser 1.

FIG. 2 schematically shows a design of a special apparatus forlaser-based interruption of electrically conductive paths on a microchip(link blow). Such a material processing task is present, in particular,in conditioning memory chips. The method according to the invention canbe advantageously employed to utilize the achieved material selectivityin order to avoid damage to the substrate of the microchip, which damageis otherwise caused by inaccuracy of spatial superposition of the laserlight on the conductive paths to be processed (cf. also U.S. Pat. No.6,281,471). Since a change in the temperature of the object to beprocessed also occurs during material processing, by which change theabsorption spectra of the individual material components are shifted,the effect of the method according to the invention is particularlyadvantageous, because otherwise there would be an impairment of materialselectivity by the shift of said absorption spectra of the compositematerials. This could also result in processing errors and damage to theobject to be processed.

The apparatus contains a femtosecond laser 7, which is connected to anamplitude-modulating pulse shaper 9 via a laser amplification stage 8,the control input of said pulse shaper 9 being connected for amplitudemodification to the output of a control unit 10. The laser pulses of thefemtosecond laser 7 pass to an achromatic objective 11 afteramplification and after modulation of their spectral amplitude, whichobjective guides the laser beam to a zone 12 of interaction with anobject 13 to be processed. The object 13 to be processed is arranged ona coordinate stage 14 which allows positioning of the object 13 to beprocessed in three spatial directions. For example, theamplitude-modifying pulse shaper 9 can be realized by an opticalarrangement according to U.S. Pat. No. 4,626,257 which includes aspatial separation of the spectral components of the laser beam by meansof a diffraction grating and subsequent imaging of the spectrum into aFourier plane by means of a lens. A polarization-rotating, strip-shapedliquid crystal matrix (twisted nematic liquid crystal matrix) arrangedin said Fourier plane serves as a spatial light modulator and causesmodification of the polarization condition of the spectral componentstraversing the individual strips. In said patent document, a subsequentpolarizer (analyzer) serves to transfer the thus achieved modificationof the polarization condition of the individual spectral components intothe desired spectral amplitude modulation. A further lens and a furtherdispersive element having the same parameters as the corresponding inputcomponents cause a transformation of the spatially separated spectrumback into the laser beam (collimation).

Suitable selection of the parameters for pulse shaping allows materialselectivity to be achieved by adapting the spectral amplitude of thelaser pulses to the absorption spectrum of the material component to beprocessed so as not to damage adjacent zones of other material duringlaser processing. Moreover, temperature changes can be reacted to, whichchanges result from the material processing and shift the absorptionspectra of the composite materials. In this case (cf. FIG. 1), ameasurement sensor (not shown in FIG. 2 for a better overview) forsensing the temperature could be arranged on the object 13 to beprocessed, said sensor being connected to the control unit 10. Using atemperature-dependent control during laser material processing in thiscase the pulse shaper would allow dynamic adaptation of the spectralamplitude of the laser pulses to the absorption characteristic of thematerial to be ablated, so that temperature changes in the processingprocess would not affect material selectivity.

The practice of the invention is not restricted to the embodiments givenherein, and improvements made by a skilled person are not outside thescope of protection as defined by the claims.

The invention claimed is:
 1. A method for processing material of anobject, comprising: generating laser radiation delivered as laser pulseshaving a large spectral bandwidth and irradiating the material with thelaser pulses to process the material by causing a processing effectinvolving a physical or chemical change in the material, the methodfurther comprising: considering a spectral dependency of the processingeffect before or during the processing; and altering the generated laserradiation before or during the processing to optimize the processingeffect by selectively modifying, according to the spectral dependency ofthe processing effect, the spectral composition of the followingparameter of the laser radiation: spectral distribution of amplitude orphase in the laser pulses.
 2. The method of claim 1, wherein the laserpulses are altered by spatially separating spectral components of thelaser radiation, modifying different spectral components differently andcollimating the spectral components back into a pulsed laser beam,wherein the modification of the different spectral components relates tothe spectral dependency of the processing effect.
 3. A method ofprocessing material of an object comprising: generating laser radiationdelivered as laser pulses having a large spectral bandwidth, andirradiating the material with the laser pulses to process the materialby causing a processing effect that creates a physical or chemicalchange in the material, the method further comprising: determining aspectral dependency of the processing effect before or during theprocessing; and altering the generated laser radiation before or duringprocessing to achieve defined processing effects by selectivelymodifying a spectral parameter of the laser radiation according to thespectral dependency of the processing effect, wherein the modifiedspectral parameter is a spectral distribution of amplitude or phase inthe laser pulses.
 4. The method of claim 3, wherein one of the followingdefined processing effects are evaluated when considering the spectraldependency: an increase in processing speed, an improvement in materialselectivity, an improvement in surface structuring, an achievement of anoptical breakthrough, and any combination thereof.
 5. The method ofclaim 3, wherein determining the spectral dependency comprises testingthe spectral parameter of the laser pulses for its processing effect andselecting values for the tested spectral parameter as start values forthe material processing.
 6. The method of claim 3 wherein determiningthe spectral dependency comprises selecting values for the spectralparameter from test results or pre-stored data as start values for theprocessing.
 7. The method of claim 3, wherein the laser pulses arealtered by spatially separating spectral components of the laserradiation, modifying different spectral components differently andcollimating the spectral components back into a pulsed laser beam,wherein the modification of the different spectral components relates tothe spectral dependency of the processing effect.
 8. The method of claim3, further comprising measuring a quantity of the processing effect anddynamically modifying the spectral parameter as a function of themeasured quantity.
 9. The method of claim 8, wherein a removal rate ofmaterial processing serves as the measurable quantity.
 10. The method ofclaim 8, wherein a surface roughness serves as the measurable quantity.11. The method of claim 8, further comprising using a transmission ofthe object to be processed as the measurable quantity producing orprocessing an optical wave guide.
 12. The method of claim 8, furthercomprising using a reflection of electromagnetic waves as the measurablequantity for producing or processing an optical wave guide.
 13. Themethod of claim 8, wherein a fraction of laser light reflected by aprocessing zone serves as the measurable quantity.
 14. The method ofclaim 8, further comprising providing a component having resonancefrequencies and using at least one of the resonance frequencies as themeasurable quantity for producing or processing a micro-mechanicalcomponent.
 15. The method of claim 8, wherein a resonance amplitude at adefined oscillation frequency serves as the measurable quantity forproducing or processing a micro-mechanical component.
 16. The method ofclaim 8, further comprising evaluating a hydrohobicity or ahydrophilicity of a processing surface as the measurable quantity. 17.The method of claim 8, further comprising evaluating an anisotropy of aprocessed material as the measurable quantity.
 18. The method of claim8, further comprising using a material selectivity of an interactionwith composite materials as the measurable quantity in the processing ofcomposite materials.
 19. The method of claim 8, wherein, in two-photonpolymerization of photosensitive materials, the measurable quantitiesare selected from the group consisting of: a quantum efficiency of thepolymerization process, optical properties of the polymerized materials,mechanical properties of the polymerized material, and any combinationsthereof.
 20. The method of claim 8, further comprising using at leastone electrical property of a microelectronic component as the measurablequantity in processing the microelectronic component.
 21. The method ofclaim 20, further comprising selecting said electrical property from thegroup consisting of: conductivity and capacitance.
 22. The method ofclaim 8, wherein the material is human eye tissue and further comprisingmeasuring at least one plasma parameter as the measured quantity. 23.The method of claim 22, further comprising selecting the plasmaparameter from the group consisting of: an energy threshold value for anoptical breakthrough, a scattered light, a plasma spectrum, and anycombinations thereof.